Blog

What is Siconi?

What is the Siconi process?

Siconi™ process details. Siconi™ clean is based on remote plasma process including two main steps usually called etch and anneal steps. During the etch step, the fluorosilicate salts are generated on the wafer through the reaction of NH4F reactive species with SiO2 thin film in presence (Fig. 2a).

How does siconi™ clean work?

  • Siconi™ process details Siconi™ clean is based on remote plasma process including two main steps usually called etch and anneal steps. During the etch step, the fluorosilicate salts are generated on the wafer through the reaction of NH4F reactive species with SiO 2 thin film in presence (Fig. 2 a).

What is siconi™ etching?

  • A method of etching silicon-containing material is described and includes a SiConi™ etch having a greater or lesser flow ratio of hydrogen compared to fluorine than that found in the prior art.

What is the difference between siconi™ and Ar plasma chamber?

  • Effectively the pedestal temperature increases to 200 °C in degas chamber and no cooling system at the backside of the wafer is available in Ar plasma chamber, contrary to Siconi™ one. The Siconi™ is quite sensitive to the wafer temperature because the pedestal temperature is set at 35 °C during etch step]

image-What is Siconi?
image-What is Siconi?
Share this Post: